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Main Product

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CAS No. :
Chemical Name: PvcStabilizer
Synonyms: PvcStabilizer
Molecular Formula:
Formula Weight: 0

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CAS No. :
Chemical Name: POLY BUTYLENE TEREPHTHALATE RESIN
Synonyms: POLY BUTYLENE TEREPHTHALATE RESIN
Molecular Formula:
Formula Weight: 0

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CAS No. :
Chemical Name: HEXAMINE
Synonyms:
Molecular Formula:
Formula Weight: 0

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CAS No. :
Chemical Name: polymer flocculant
Synonyms: polymer flocculant ; macromolecular flocculant
Molecular Formula:
Formula Weight: 0

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CAS No. :
Chemical Name: ELECTRONIC GRADE STRIPPER FOR SEMICONDUCTOR
Synonyms: Remover ; ELECTRONIC GRADE STRIPPER FOR SEMICONDUCTOR
Molecular Formula:
Formula Weight: 0

Other Product List

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O,O’-Dioctadecylpentaerythritol bis(phosphite) 3806-34-6
3-Bromopropyne 106-96-7
POLY[(O-CRESYL GLYCIDYL ETHER)-CO-FORMALDEHYDE] 29690-82-2
Pyridine 110-86-1
FLEXIBLE COPPER CLAD LAMINATE
PBGA
Resin epoxy 24969-06-0
HEXAMINE
COPPER ELECTROLYTE
Polyvinyl Butyral Interlayer Film
DRY PAPER STRENGTH RESIN
MOLD CLEANER
Sodium formate 141-53-7
Trimethylol propane 77-99-6
Chromium 7440-47-3
FURFURYL ALCOHOL RESIN 25212-86-6
RECYCLED CLEANING LIQUID
INSULATION PAPER
PLASTICIZER
N,N’-Methylenebisacrylamide 110-26-9
POLY(VINYL ALCOHOL) 25213-24-5
Acetic acid glacial 64-19-7
polymer flocculant
LIQUID PHOTO RESIST
PHENOLIC COPPER CLAD LAMINATES
HIGH SOLIDS AMINO CROSSLINKING AGENT
THERMO PLASTIC POLYESTER ELASTOMER
PHOSPHITES ANTIOXIDANTS
NA
LACQUER THINNER
POLY(VINYL BUTYRAL) 27360-07-2
PAPER-PHENOLIC COPPER CLAD LAMINATE
GLASS FIBER (SHORT FIBER)
N/A
PROPYLENE GLYCOL METHYL ETHER ACETATE 84540-57-8
4,4′-DIHYDROXYDIPHENYLMETHANE 620-92-8
ETHYL 2-CYANOACRYLATE 7085-85-0
UREA RESIN MOLDING COMPOUND
UREA RESIN ADHESIVE
PvcStabilizer
EPOXY RESIN MOLDING COMPOUND
POLY BUTYLENE TEREPHTHALATE RESIN
1,3,5-trioxane 110-88-3
OVER-LAY RESIN
SINGLE SIDE PPCCL
E-GLASS FIBER CHOPPED STRAND
DRY FILM PHOTO RESIST
HIGH PURITY HYDROGEN PEROXIDE FOR SEMI-CONDUCTOR
SYNTHETIC RESIN FOR COATING
WET PAPER STRENGTH RESIN
Epoxidized soya bean oil 8013-07-8
MELAMINE RESIN MOLDING COMPOUND
FORMAL SALINE
MOLD CLEANER FOR SEMI-CONDUCTOR
POLYETHYLENE DRUM
Methanol 67-56-1
3-Picoline 108-99-6
ETCHING LIQUID
Copper 7440-50-8
CHEMICAL MECHANICAL POLISHING
ELECTRONIC GRADE PROPYLENE GLYCOL MONOMETHYL ETHER
BROMINATED EPOXY FLAME RETARDANT
Carbomer 940 9003-01-4
RECYCLED FOIL
ELECTRONIC GRADE STRIPPER FOR SEMICONDUCTOR
PHENOLIC RESIN MOLDING COMPOUND
ELECTRONIC GRADE ETHANOL AMINE
ULTRA THIN MULTILAYER
ELECTRONIC GRADE THINNER FOR SEMICONDUCTOR
TEXTILE RESIN
POLYVINYL ACETATE EMULSION
HINDERED PHENOL ANTIOXIDANTS
POLY(VINYL ALCOHOL-CO-ETHYLENE) 26221-27-2
PHENOL-FORMALDEHYDE RESIN 9003-35-4
melamine resin adhesive
Butyl acetate 123-86-4
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
TRIPHENYL PHOSPHATE FLAME RETARDANT
ELECTRONIC GRADE PROPYLENE GLYCOL MONOMETHYL ACETATE
ELECTRONIC GRADE NORMAL BUTYL ACETATE
Nicotinic acid 59-67-6
GLASS EPOXY COPPER CLAD LAMINATE
TETRAHYDROFURAN, FOR HPLC [SUBSTITUTED BY 34865 RIEDEL]
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